November 15, 2012 – AAEON released GENE-QM77 3.5” SubCompact SBCs.
Designed for the latest 3rd Generation Multi-core Intel Core iSeries processors and complemented by the Intel QM77 or HM76 chipset, the GENE-QM77 Rev.A and GENE-QM77 Rev.B boards offer superb graphic performance via Intel InTru 3D Technology and Clear Video HD Technology, rich connectivity, dual independent Full HD displays, remote management through iAMT 8.0 and Rapid Storage Technology. The 3rd Generation Intel Core iSeries processors offer an overall 38% improvement over its 2nd Generation predecessors.
With a lower thermal envelop, it is a clear first choice when designing high performance and small embedded devices at the advent of the Cloud era. The GENE-QM77 Rev.B SubCompact board uses onboard BGA processors, offering Intel Core i7-3555LE and Celeron 847E options and supports SODIMM DDR3 1333/1600 with a maximum of 8GB memory.
Measuring at a mere 146mm x 101.6mm in size, it features a rich array of I/O interfaces and extensions, with two Gigabit Ethernet ports, one CRT (or DVI-I optional), one HDMI, two 18/24-bit dual-channel LVDS interfaces, 2-channel High Definition Audio, two SATA 6.0Gb/s (support of RAID 0,1), one CFast, two USB3.0, six USB2.0, four COM, a programmable 8-bit Digital I/O, one Mini Card slot, onboard 4/5/8-wire Resistive Touch Screen controller and onboard TPM v1.2 support for security conscious applications.
DirectX 11, OpenGL 3.1, OpenCL 1.1 and stereoscopic 3D are supported, enhancing up to 50% 3D graphics performances and up to 1.8X real time HD-HD transcode improvements.
With the exception of the HDMI port, the GENE-QM77 Rev.A SubCompact board offers identical features and uses socket-type Intel Core i7/i5/i3 mobile processors. The GENE-QM77 is also available in a ready-to-go chassis TKS-G50-QM77 for faster time-to-market for system integrators and software developers. It is Windows 8 ready and supports most legacy embedded Operating Systems.
