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B&R Presents the New X67 High Density Modules

Source: B&R Industrial Automation Corp.
26 May, 2005
1 min read

Remote Automation - Maximum flexibility in a compact design now also available with an increased number of I/O Points

B&R proudly presents the new X67 High Density Modules. Besides the standard X67 I/O Modules with up to 12 I/O points B&R has expanded its product range to now also include High Density Modules with up to 32 Channels. Generally, the B&R X67 system frees I/O Modules from the switching cabinet by providing a comprehensive remote I/O directly on the machine. X67 I/O Modules are designed for rough industrial conditions and as standard have IP67 protection and excellent EMC properties. Extensive status information, directly indicated via LEDs or software, is available on all X67 I/O system modules.

Increased Efficiency

The X67 I/O system provides a cost reduction through easy handling (e.g. expensive wiring is reduced to two lines: bus and power lines), seamless integration, extensive diagnostic functions and optimal serviceability. A wide Varity of I/O modules with a compact design and distances up to 300 feet between modules give the customer absolute freedom when constructing a system. Modules with an valve connections are also possible.

This allows comprehensive remote automation to become reality. Open Communication via CAN, CANopen, DeviceNet, Profibus DP and ETHERNET PowerlinkTM is guaranteed. Other Features include Integrated Status LED’s, totally sealed housing for use in rough environments, central attachments for sliding lock nut installations, integrated T-connector for fieldbus connection.

For more information visit www.br-automation.com .

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