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OPC Foundation Showcases Industrial Digitalization Integrated Architecture at SPS 2022
The OPC Foundation continues to prove it is the strongest and broadest open multivendor standards ecosystem for building integrated digital manufacturing businesses. -
Rockwell Automation Fair Boasts Record Signups After Three-Year Hiatus
18,000 people signed up online, and a record 11,000 people showed up to the first in-person Rockwell Automation Fair in three years. -
Case Study: AI-Based Autonomous Control
AI-based autonomous control runs a semiconductor plant’s HVAC system. This feature originally appeared in the October 2022 issue of InTech magazine. -
SS&C Releases Intelligent Automation Survey Results
More than half of the 290 respondents said their organizations were prioritizing intelligent automation investments over the next 12-24 months. -
Engineering Skills Needed by Industrial Automation Systems Integrator Firms
Global systems integrator market report identifies needs of system integration firms. -
Siemens Wins New Order for Grid Control and Smart Metering Infrastructure in Egypt
Siemens has been awarded a new contract to establish a distribution management system and advanced metering infrastructure for North Delta Electricity Distribution Company (NDEDC). -
CNC Technology Leader Opens Second Facility in China
CNC specialist NUM has opened a second branch in China, further consolidating its position within the country. -
Consumers Want More Transparency on How Businesses Handle Their Data, Cisco Survey Shows
Consumers are supportive of Artificial Intelligence (AI) but are concerned about how businesses use AI; 65% have lost trust in organizations due to their AI use. -
How to Secure Operational Technology Data with an All-in-One Computing Platform
As the scale of the OT data grows, with many businesses adopting a distributed edge computing approach, securing OT data and edge devices against cyberattacks is more important than ever. -
PICMG COM-HPC Mini Working Group Reaches Key Milestone in Record Time
PICMG, a leading consortium for the development of open embedded computing specifications, announces that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in record time.










