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Power CAD, Simulation & Digital Twins
Accelerate simulation, CAD, and digital twin workflows with the NVIDIA RTX PRO 6000 Blackwell Workstation Edition. Get powerful AI-enhanced performance, advanced visualization, and enterprise-ready capabilities for demanding projects. -
Precision Motion with Brother Servo Gearboxes
Compact, low-backlash servo gearboxes built to deliver precise motion, high torque density, and reliable automation performance. -
The Next Evolution in Process Control Is Here
DeltaV™ version 16.LTS Distributed Control System (DCS) builds on decades of field-proven innovation to deliver the most robust and reliable release yet. -
Connect Operations, Data, and Insights with GENESIS
Stop struggling with disconnected data. GENESIS unifies SCADA, visualization, historian, and analytics in one platform.
25,378 Products
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OES introduces series of XYZ positioning stages
They are offered in 5 travel lengths for each axis, 50 mm (1.969 in.), 100 mm (3.937 in.), 150 mm (5.906 in.), 200 mm (7.874 in.), and 300 mm (11.811 in.). Any combination of lengths, motors, and lead screws are available. -
Nippon Pulse introduces PFL20 Linearstep motor
Nippon Pulse's tin-can linear actuators, including the Linearstep, are also available for customization; contact an applications engineer to learn more about our customization capabilities. -
Siemens Digital Industries Software announces enhancements to Simcenter system simulation solutions
With the latest release of Simcenter system simulation solutions, each solution has been updated to help accelerate innovation, increase collaboration and enhance productivity to meet rapidly changing customer and market needs. -
Teledyne Lumenera releases Lt Series USB3 cameras
Teledyne Lumenera’s Lt Series Cameras offer an imaging solution and are designed specifically to meet the challenges of modern imaging systems that strive to provide vision performance while using less power. -
KEMET introduces Class 1 C0G dielectric system with KONNEKT technology
This technology combines KC-LINK’s C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution suited for both packaging and applications.
